BACO xT-200S PVD SYSTEM - Product

Wafer Size :6"~8" , Load-lock cassette 25slot
Buffer chamber Wafer Orient , Degas temp <250℃
Process chamber : DC Power [Option DC+RF]
Water cooling chuck & Ar gas 
[Option CCD : Wafer Scratch and Broken Detection]
Process : Metal , Oxide , TCO
UBM ,WLP , Thin wafer , Black metal , Mosfet ,Power Semiconductor Device

1. Load-lock chamber A.B
2. Align & Degas chamber A.B
3. Transfer chamber 
4. PVD Chamber 1.2.3.4
5. Cool Chamber [CCD]